High voltage switching circuitry for a cross-point array

ABSTRACT

Circuitry for generating voltage levels operative to perform data operations on non-volatile re-writeable memory arrays are disclosed. In some embodiments an integrated circuit includes a substrate and a base layer formed on the substrate to include active devices configured to operate within a first voltage range. Further, the integrated circuit can include a cross-point memory array formed above the base layer and including re-writable two-terminal memory cells that are configured to operate, for example, within a second voltage range that is greater than the first voltage range. Conductive array lines in the cross-point memory array are electrically coupled with the active devices in the base layer. The integrated circuit also can include X-line decoders and Y-line decoders that include devices that operate in the first voltage range. The active devices can include other active circuitry such as sense amps for reading data from the memory cells, for example.

FIELD OF THE INVENTION

The invention relates generally to data storage technology. Morespecifically, the invention relates to circuitry associated withnon-volatile re-writeable memory.

BACKGROUND

Traditional memory support circuits are used to write and read data fromarrayed memory cells. Examples of memory support circuits include senseamplifiers, row decoders, column decoders, pass gates, and the like.Decoder circuits, such as row decoders, can further include rowselection circuits and drivers. Semiconductor memories typically requirea certain amount of planar area to form memory support circuits, theplanar area usually being determined by the quantities and types ofdevices (as well as device configurations) that are used to form thesupport circuitry. Further, complementary metal-oxide-semiconductor(“CMOS”) fabrication technologies are commonly used to form the devicesof the memory support circuits, the CMOS-based devices requiring planararea for both n-channel and p-channel semiconductor structures.

Certain approaches to semiconductor memory technologies provide fordecoders that typically select blocks of memory, such as 512 kb to 1 Mbsized blocks of memory, for switching voltages onto a relatively largenumber of decoded array lines on a block-by-block basis as in, forexample, NOR FLASH memory technologies. Further, some approaches usehigh-voltage circuitry to generate programming voltages, which typicallyconsumes relatively more surface area than other circuitry. Thehigh-voltage circuitry is usually designed to withstand higher voltagesto ensure structural integrity.

There are continuing efforts to improve voltage generation for accessingnon-volatile re-writable memory technologies.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention and its various embodiments are more fully appreciated inconnection with the following detailed description taken in conjunctionwith the accompanying drawings, in which:

FIG. 1A depicts an integrated circuit including memory cells disposed ina single layer or in multiple layers of memory, according to variousembodiments of the invention;

FIG. 1B depicts decoders used to access a memory cell disposed in asingle layer or in multiple layers of memory, according to variousembodiments of the invention;

FIG. 1C depicts an example of voltage signals generated by a X-linedecoder and a Y-line decoder having voltages in one range to generatevoltages in another range, according to some embodiments;

FIG. 2 depicts one example of a predecoder including predecoder logicand a level shifter circuit, according to at least some embodiments ofthe invention;

FIG. 3A depicts another example of a decoder, according to at least someembodiments of the invention;

FIG. 3B depicts an example of a negative voltage level shifter,according to at least some embodiments of the invention;

FIGS. 4A to 4D depict examples of a driver operating in response tovarious states of input, according to at least some embodiments of theinvention;

FIG. 5 depicts a decoder including a number of stages, according to atleast some embodiments of the invention;

FIG. 6 depicts one example of a decoder including a predecoder and adecoder, according to at least some embodiments of the invention; and

Although the above-described drawings depict various examples of theinvention, the invention is not limited by the depicted examples. It isto be understood that, in the drawings, like reference numeralsdesignate like structural elements. Also, it is understood that thedrawings are not necessarily to scale.

DETAILED DESCRIPTION

Various embodiments or examples of the invention may be implemented innumerous ways, including as a system, a process, an apparatus, or aseries of program instructions on a computer readable medium such as acomputer readable storage medium or a computer network where the programinstructions are sent over optical, electronic, or wirelesscommunication links. In general, operations of disclosed processes maybe performed in an arbitrary order, unless otherwise provided in theclaims.

A detailed description of one or more examples is provided below alongwith accompanying figures. The detailed description is provided inconnection with such examples, but is not limited to any particularexample. The scope is limited only by the claims, and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the following description in order toprovide a thorough understanding. These details are provided as examplesand the described techniques may be practiced according to the claimswithout some or all of the accompanying details. For clarity, technicalmaterial that is known in the technical fields related to the exampleshas not been described in detail to avoid unnecessarily obscuring thedescription.

U.S. patent application Ser. No. 11/095,026, filed Mar. 30, 2005,published as U.S. Pub. No. 2006/0171200, and entitled “Memory UsingMixed Valence Conductive Oxides,” is hereby incorporated by reference inits entirety for all purposes and describes non-volatile thirddimensional memory elements that may be arranged in a two-terminal,cross-point memory array. New memory structures are possible with thecapability of this third dimensional memory array. In at least someembodiments, a two-terminal memory element or memory cell can beconfigured to change conductivity when exposed to an appropriate voltagedrop across the two-terminals. The memory element can include anelectrolytic tunnel barrier and a mixed valence conductive oxide. Avoltage drop across the electrolytic tunnel barrier can cause anelectrical field within the mixed valence conductive oxide that isstrong enough to move oxygen ions out of the mixed valence conductiveoxide and into the electrolytic tunnel barrier. When certain mixedvalence conductive oxides (e.g.,praseodymium-calcium-manganese-oxygen—PCMO perovskites andlanthanum-nickel-oxygen—LNO perovskites) change valence, theirconductivity changes. Additionally, oxygen accumulation in certainelectrolytic tunnel barriers (e.g., yttrium stabilized zirconia—YSZ) canalso change conductivity. If a portion of the mixed valence conductiveoxide near the electrolytic tunnel barrier becomes less conductive, thetunnel barrier width effectively increases. If the electrolytic tunnelbarrier becomes less conductive, the tunnel barrier height effectivelyincreases. Both mechanisms can be reversible if the excess oxygen fromthe electrolytic tunnel barrier flows back into the mixed valenceconductive oxide. A memory can be designed to exploit tunnel barrierheight modification, tunnel barrier width modification, or both.

In some embodiments, an electrolytic tunnel barrier and one or moremixed valence conductive oxide structures do not need to operate in asilicon substrate, and, therefore, can be fabricated above circuitrybeing used for other purposes. For example, a substrate (e.g., asilicon—Si wafer) can include active circuitry (e.g., CMOS circuitry)fabricated on the substrate as part of a front-end-of-the-line (FEOL)process. After the FEOL process is completed, one or more layers oftwo-terminal cross-point memory arrays are fabricated over the activecircuitry on the substrate as part of a back-end-of-the-line process(BEOL). The BEOL process includes fabricating the conductive array linesand the memory cells that are positioned at cross-points of conductivearray lines (e.g., row and column conductive array lines). Aninterconnect structure (e.g., vias, thrus, plugs, damascene structures,and the like) may be used to electrically couple the active circuitrywith the one or more layers of cross-point arrays. Further, atwo-terminal memory element can be arranged as a cross-point such thatone terminal is electrically coupled with an X-direction line (or an“X-line”) and the other terminal is electrically coupled with aY-direction line (or a “Y-line”). A third dimensional memory can includemultiple memory elements vertically stacked upon one another, sometimessharing X-direction and Y-direction lines in a layer of memory, andsometimes having isolated lines. When a first write voltage, VW1, isapplied across the memory element (e.g., by applying ½ VW1 to theX-direction line and ½−VW1 to the Y-direction line), the memory elementcan switch to a low resistive state. When a second write voltage, VW2,is applied across the memory element (e.g., by applying ½ VW2 to theX-direction line and ½−VW2 to the Y-direction line), the memory elementcan switch to a high resistive state. Multiple memory elements can beprogrammed in parallel on a “word line.” If the Y-direction line werethe word line, ½−VW2 would be applied to a Y-direction line and ½ VW2would be applied to multiple X-direction lines (but only thoseX-direction lines connected to memory elements that are to beprogrammed). Memory elements using electrolytic tunnel barriers andmixed valence conductive oxides can have VW1 opposite in polarity fromVW2.

As used herein, a memory cell refers, at least in one embodiment, to amemory element (or a portion thereof) that is configured to store atleast one data bit (or multiple multi-level states). In one embodiment,the memory cell can include a non-ohmic device (NOD) that iselectrically in series with the memory element. In one embodiment, amemory device can include non-volatile memory cells, each of whichincludes a two-terminal memory element operative to change conductivityprofiles as a function of a write voltage applied across a firstterminal and a second terminal. The conductivity profile is indicativeof a value of data stored in the memory cell. In some cases, the memoryelement can be formed with an electrolytic tunnel barrier and a mixedvalence conductive oxide.

FIG. 1A illustrates an integrated circuit including memory cellsdisposed in a single layer or in multiple layers of memory, according tovarious embodiments of the invention. In this example, integratedcircuit 100 is shown to include either multiple layers 150 of memory(e.g., layers 152 a, 152 b, . . . 152 n) or a single memory layer 151(e.g., layer 152) formed on a base layer 154. The integrated circuit 100is a cost-effective solution to other designs that subject discretedevices to the entire range of voltages (VW1 and VW2) that are requiredto switch a memory element (e.g., see U.S. Pat. No. 6,798,685, andentitled “Multi-output Multiplexor,” which is hereby incorporated byreference in its entirety for all purposes, for an example of such adesign). If all discrete devices on the base layer 154 can operatewithin a smaller voltage range, then smaller discrete devices can beused. Smaller discrete devices mean a smaller base layer 154, which canresult in cost savings (e.g., a reduced die size).

In at least some embodiments, each layer (e.g., layer 152 or layers 152a, 152 b, . . . 152 n) of memory can be a cross point memory array 180including conductive array lines 182 and 185 arranged in differentdirections to access re-writable memory cells 181 such as two-terminalmemory cells. Examples of conductive array lines include X-linesconductive array lines (e.g., 182) and Y-lines conductive array lines(e.g., 185). Base layer 154 can include a bulk semiconductor substrateupon which memory access circuits 153 as well as other circuitry can beformed. In at least some embodiments, base layer 154 can be structuredas base layer 154 a in which a logic layer is formed on a substrate (notshown). The logic layer can be a layer that includes circuitry (e.g.,153) that can be configured to perform a variety of functions, includingfunctions for any accessing memory layer 152 to write or read data. Forexample, a decoder circuit 110 can be formed in the logic layer of thebase layer 154 to include a predecoder 120, a secondary decoder 124, androw selectors 132. Predecoder 120 can be configured to generatepredecoded signals that are communicated via path 122 to secondarydecoder 124, or to any number of secondary decoders 124 (not shown).Thus, predecoder 120 can be configured to decode a portion of an address(e.g., a group of address bits) and to generate a predecoded signal thatrepresents an intermediary decoded value that can be used by secondarydecoder 124 to determine, for example, an X-line that is to be selected(e.g., 182′) to access a corresponding memory cell (e.g., selectedmemory cell 181′) or multiple X-lines if multiple memory cells on aY-line (e.g., 185′) are to be selected. Secondary decoder 124 can beconfigured to use the intermediary decoded value to select the X-line(s)for accessing a row of memory cells. Row selector 132 can be configuredto select one of a group of rows that are determined by secondarydecoder 124 to access a specific memory cell. In at least someembodiments, row selector 132 can be optional. Similarly, the abovedescribed circuitry can be used to select a Y-line (e.g., 185′) toaccess a corresponding selected memory cell (e.g., 181′) or memorycells. Although memory cells are denoted by reference numeral 181,hereinafter, a memory cell selected for a data operation will be denotedas a selected memory cell 181′ or memory cell 181′ because a voltageoperative to perform a data operation on the selected memory cell 181′is applied across the terminals of that memory cell.

In some embodiments, decoder 110 and/or any of its constituent elementscan be composed of devices configured to operate within a voltage rangethat is compatible with the devices. For example, the devices each canbe a metal-oxide semiconductor (“MOS”) transistor 191 that include agate terminal (“G”) 194, a drain terminal (“D”) 192, a source terminal(“S”) 196, and a well 197 in which metal-oxide semiconductor transistor191 can be disposed. In some embodiments, well 197 can be the bulksubstrate. Metal-oxide semiconductor transistor 191 further includes anoxide structure (“OX”) 195, a junction between the source 196 and thewell 197, and a junction between the drain 192 and the well 197, all ofwhich determine the voltage range that is compatible with the devices,above which the structure or functionality of the device may beaffected. For example, the MOS transistors on a substrate might be ableto withstand a range of three volts (e.g., from 0 v to +3 v, or from −3v to 0 v). Further, a selected memory cell 181′ of memory layers 152 canbe formed between selected conductive array lines 182′ and 185′, acrosswhich another voltage range can be applied to perform write and readoperations (e.g., data operations), including programming and erasingdatum or data stored in memory cell 181′. In some embodiments, the othervoltage ranges required for data operations on the memory cells includemagnitudes that extend beyond the voltage range useable for metal-oxidesemiconductor transistor 191. For example, the other voltage range mightinclude a programming voltage of +6 v across the memory cell and anerase voltage of −6 v across the memory cell. In other words, unlesshigh voltage circuitry was used on the substrate, a single discretedevice would not be capable of delivering to the conductive array linesthe entire voltage necessary for data operations.

In view of the foregoing, the structures and/or structures of integratedcircuit 100 can implement a fabrication process to form decoder 110 aswell as its constituent elements, including predecoder 120, secondarydecoder 124 and row selector 132. Thus, base layer 154 a, as well asdecoder 110 and its constituent elements, can be fabricated withequivalent devices, rather than implementing circuitry (e.g., highvoltage circuitry) having structures that are configured to operate atvoltage ranges that can be higher than other devices, such asmetal-oxide semiconductor transistor 191. To illustrate, consider thatmetal-oxide semiconductor transistor 191 operates with voltages from 0to VCCQ in devices fabricated in CMOS processes. According to at leastsome embodiments, metal-oxide semiconductor transistor 191 can be usedto generate at a portion of a voltage swing from +VCCQ to −VCCQ forwriting to memory cell 181. Also, decoder 110 or its constituentelements can facilitate selective switching to access fewer X-lines orY-lines (e.g., a single X-line and a single Y-line) than otherwise mightbe the case when X-lines and Y-lines are accessed at a block-level.Further, predecoder 120 can include level shifters configured togenerate either negative or positive voltages in response to logicvalues associated with positive voltages, such as zero volts (e.g.,logical value of 0) and 1.8 or 3.0 volts (e.g., logical value of 1).

FIG. 1B illustrates decoders used to access a selected memory celldisposed in a single layer or in multiple layers of memory, according tovarious embodiments of the invention. As shown, an X-line decoder 172and a Y-line decoder 174 are configured respectively to drive voltagesignals on array line 185′ and array line 182′ to write and read data toselected memory cell 181′. In some embodiments, X-line decoder 172 andY-line decoder 174 are composed of devices configured to operate inranges from 0 to +V volts or from −V to 0 volts, but are configured tocollaborate to apply a voltage difference of 2V (e.g., a potentialdifference from −V to +V) to memory cell 181′. As shown, X-line decoder172 and Y-line decoder 174 can facilitate selective switching byaccessing individual lines, such as X-line 182′ and Y-line 185′ ratherthan accessing memory cell 181′ as part of accessing multiple memorycells along an entire Y-line 185′. Thus, X-line decoder 172 and Y-linedecoder 174 can selectively apply portions of a voltage via respectivearray lines 182′ and 185′.

FIG. 1C illustrates an example of voltage signals generated by a X-linedecoder and a Y-line decoder, the individual voltages having voltages inone range to generate combined voltages in another range, according tosome embodiments. Diagram 160 illustrates that an X-line can be drivenby a signal 161 within voltage ranges from 0 to +V volts and from −V to0 volts (e.g., ΔV≈|V|), and that a Y-line can be driven by a signal 161within voltage ranges from −V to 0 volts and from 0 to +V volts (e.g.,ΔV≈|V|). As shown, signal 161 and signal 162 includes a +V voltage and a−V voltage, respectively, to apply a voltage of 2V (e.g., of positivepolarity) across memory cell 181′. In this example, a positive voltageon the X-line and a negative voltage on the Y-line programs memory cell181′ with, for example, a logical value of “1”. FIG. 1D illustratesanother example of voltage signals generated by an X-line decoder and aY-line decoder, the individual decoders having voltages in one range togenerate combined voltages in another range, according to someembodiments. Diagram 164 illustrates that an X-line can be driven by asignal 168 within voltage ranges from 0 to +V volts and from −V to 0volts (e.g., ΔV≈|V|), and that a Y-line can be driven by a signal 166within voltage ranges from −V to 0 volts and from 0 to +V volts (e.g.,ΔV≈|V|. As shown, signal 168 and signal 166 includes a −V voltage and a+V voltage, respectively, to apply a voltage of 2V (e.g., of negativepolarity) across memory cell 181′. In this example, a negative voltageon the X-line and a positive voltage on the Y-line erases memory cell181′ to represent, for example, a logical value of “0”. In view of theforegoing, X-line decoders and Y-line decoders can be configured to havestructures that are suitable to provide less than the voltage differencethat is applied across memory cell 181′, thereby enabling the X-linedecoders and the Y-line decoders to be composed of devices equivalent toothers formed in the base layer 154.

FIG. 2 depicts a predecoder 240 including predecode logic 241 and alevel shifter circuit 242, according to at least some embodiments of theinvention. Predecode logic 241 can be configured to generate predecodedsignals that are communicated via one or more paths 247 that arecollectively denoted as bus 250. In this example, predecode logic 241can be configured to receive a portion of an address, such as addressbits A0 and A1, and to generate a predecoded signal indicating whetherA0 is either in one state (i.e., A0) or in another state (i.e., /A0, ornot A0), and whether A1 is either in one state or another state (i.e.,/A1, or not A1). Level shifter circuit 242 is shown in this example toinclude two level shifters: a level shifter (“L/S (PV)”) 244 configuredto shift between an intermediate value or reference value, V0, (e.g., 0volts) and a positive voltage value, +V, (e.g., +3V), and a levelshifter (“L/S (NV)”) 246 configured to shift between an intermediatevalue or reference value, V0, (e.g., 0 volts) and a negative voltagevalue, −V, (e.g., −3V). Level shifter circuit 242 can also include adriver 243, which can be configured to select any of the values of thepositive voltage, intermediary voltage, and the negative voltage and togenerate level-shifted voltages, such as +V, 0, and −V volts. In atleast some embodiments, the operation of level shifter 244 and levelshifter 246 are mutually exclusive. That is, when level shifter 244 istransmitting +V volts and V0 volts via paths 280 and 282, respectively,or when level shifter 244 is transmitting V0 volts and +V volts viarespective paths 280 and 282, level shifter 246 can transmit 0 volts onboth path 290 and path 292. Similarly, when level shifter 246 istransmitting V0 volts and −V volts via paths 290 and 292, respectively,or when level shifter 246 is transmitting −V volts and V0 volts viarespective paths 290 and 292, level shifter 244 can transmit 0 volts onboth path 280 and path 282.

Further, driver 243 can include a first driver portion configured tooperate during a programming operation, and a second driver portionconfigured to operate during an erase operation. Consider that driver243 can be disposed in an X-line decoder. Thus, driver 243 can beconfigured to accept +V volts and 0 volts from level shifter 244 duringprogramming operations. If the X-line is selected to program a memorycell, then driver 243 can provide +V volts onto output terminal 249,which, in turn, is transmitted via an X-line to a memory cell 181′ (notshown). Otherwise, if the X-line is unselected during the programming ofa memory cell 181, then driver 243 can provide 0 volts onto outputterminal 249. Further consider that driver 243 can be disposed in aY-line decoder. Thus, driver 243 can be configured to accept +V voltsand 0 volts from level shifter 244 during erasing operations. If theY-line is selected to erase a memory cell 181′, then driver 243 canprovide +V volts onto output terminal 249, which, in turn, istransmitted via a Y-line to a memory cell 181′. Otherwise, if the Y-lineis unselected during the erasing of the memory cell 181, then driver 243can provide 0 volts onto output terminal 249. Driver 243 can interactwith level shifter 246 in a similar manner.

In some embodiments, one or more devices that constitute negativevoltage level shifter can be composed of three-terminal devices eachincluding a first terminal, a second terminal, and third terminal. Insome other embodiments, one or more devices that constitute negativevoltage level shifter can be composed of four-terminal devices in whichthe fourth terminal is coupled to a well and to one of the firstterminal, the second terminal, or the third terminal. In some cases, theone or more devices can be formed in common or separate wells orportions of a bulk substrate. If the one or more devices are MOSdevices, then the first terminal, the second terminal, the thirdterminal, and the fourth terminal can correspond respectively to, forexample, a drain terminal, a gate terminal, a source terminal, and awell (or bulk) terminal.

FIG. 3A depicts another example of a decoder, according to at least someembodiments of the invention. Decoder 300 includes logic 301, a negativevoltage level shifter 303 a, a positive voltage level shifter 303 b, adriver 306, and a row selector 307. Logic 301 includes circuitryconfigured to control operation of negative voltage level shifter 303 aand positive voltage level shifter 303 b. For example, logic 301 can beconfigured to receive one or more address bits to determine whetherdecoder 300 is associated with an array line that is used to access amemory cell 181, as well as control signals (e.g., program mode and/orerase mode signals) to determine which of negative voltage level shifter303 a and positive voltage level shifter 303 b can be used to generatevoltage signals as a function of the control signals. Negative voltagelevel shifter 303 a can include a level shifter 302 a and a levelshifter 304 a. For example, level shifter 302 a can be configured toapply a negative voltage (e.g., −3V) to output terminal 305 a during afirst state, and can be configured to apply a reference voltage (e.g.,0V) to output terminal 305 a during a second state. Level shifter 304 acan be configured to apply the reference voltage to output terminal 305b during the first state, and can be configured to apply the negativevoltage to output terminal 305 b during the second state. Positivevoltage level shifter 303 b can include a level shifter 302 b and alevel shifter 304 b to enable positive voltage level shifter 303 b tooperate in a manner similar to negative voltage level shifter 303 a, butgenerates voltage levels in a positive voltage range between, forexample, 0V and +3V. The selected one of negative voltage level shifter303 a and positive voltage level shifter 303 b can transmit a range ofvoltages (e.g., between 0V and +/−3V) to driver 306, and the unselectedother of negative voltage level shifter 303 a and positive voltage levelshifter 303 b can transmit reference voltages, such as 0V, to apply todriver 306 to maintain lines in driver 306 at levels to avoid floatinglines. In some embodiments, decoder 300 can include a row controller 308that can be configured to operate an optional row selector 307, whichcan be coupled to one or more X-lines to selectively bias or enable themin a similar fashion to logic 301, negative level shifter 303 a,positive level shifter 303 b and driver 306.

FIG. 3B depicts an example of a negative voltage level shifter,according to at least some embodiments of the invention. Negativevoltage level shifter 310 includes an input terminal 311, a first outputterminal 350, and a second output terminal 360, as well as a sourceterminal 313 a that is configured to supply one voltage (e.g., +1V), asource terminal 313 b that is configured to supply another voltage(e.g., −1V), and a source terminal 313 c that is configured to supplyyet another voltage (e.g., −3V). Negative voltage level shifter 310includes an inverter 312, which is composed of a PMOS device 315 a andan NMOS device 315 b, and an inverter 314, which is composed of a PMOSdevice 318 a and an NMOS device 318 b. Inverter 312 and inverter 314 arecoupled respectively via PMOS device 317 and PMOS device 319 to across-coupled pair of devices 320, which includes an NMOS device 322 aand an NMOS device 322 b. Further, cross-coupled pair of devices 320 iscoupled via a PMOS device 324 and a PMOS device 332, and is also coupledvia a PMOS device 321 and a PMOS device 330 cross-coupled pair ofdevices 340. Cross-coupled pair of devices 340 includes an NMOS device342 a and an NMOS device 342 b. To illustrate operation of negativevoltage level shifter 310, consider that negative voltage level shifter310 is disposed in a Y-line decoder and is in a programming mode ofoperation. Next, consider that a voltage (i.e., any value above sourceterminal 313 a) indicative of a logical value of one is applied to inputterminal 311. In response, inverter 312 is activated to provide 0V tonode 316, which turns on PMOS device 317 to couple +1V from sourceterminal 313 a to the gate of NMOS device 322 b. Cross-coupled pair ofdevices 320, in response, turns on PMOS device 324 and PMOS device 332,thereby setting node 338 to 0V, which is also applied to output terminal360. A voltage of zero volts at node 338 is transmitted to the gate ofPMOS device 342 a, which turns on to supply −3V to node 336. Thus,output terminal 350 can receive −3V, thereby generating a negativevoltage in response to a positive voltage applied at input terminal 311.In view of the foregoing, a level shifter or a first portion of negativevoltage level shifter 310 can be configured to generate a negativevoltage (e.g., −3V) at output terminal 350 during a first state (e.g.,during application of +3V, +1.8V, etc. to input 311), and to generate areference voltage (e.g., 0V) at output terminal 350 during a secondstate (e.g., during application of 0V to input 311). Another levelshifter or a second portion of negative voltage level shifter 310 can beconfigured to generate the reference voltage at output terminal 360during the first state, and to generate the negative voltage at outputterminal 360 during the second state. The first level shifter and secondlevel shifter can be configured to operate substantially concurrent witheach other. A positive voltage level shifter (not shown) for generatingpositive voltages is well known in the art.

FIGS. 4A to 4D depict examples of a driver operating in response tovarious states of input, according to at least some embodiments of theinvention. Specifically, FIGS. 4A to 4D depict a driver as driver 401, adriver 411, a driver 421, and a driver 431, respectively, as the driverbeing in different modes of operation. In some embodiments, the valuesof the input signals applied to the input terminals, such as inputterminals 402, 404, 406, and 408 of driver 401, determine the mode ofoperation for the driver. Driver 401 generates an output voltage atoutput terminal 410 as a function of the values of the input signals.Driver 401 is shown to include an input terminal 402 coupled to a gateof a PMOS device 492 and a gate of an NMOS device 490. Those skilled inthe art would appreciate that the bulk of such NMOS devices aretypically isolated from the substrate using well-in-well or deep n welltechniques. Driver 401 also is shown to include an input terminal 404coupled to a source and a well of PMOS device 492 and to a source and awell of a PMOS device 496. Further, driver 401 includes an inputterminal 406 coupled to a source and a well of an NMOS device 494 and toa source and a well of NMOS device 490. An input terminal 408 can becoupled to a gate of NMOS device 494 and a gate of PMOS device 496.Driver 401 includes an output terminal 410 that is coupled to a drain ofeach of PMOS device 492, NMOS device 490, PMOS device 496, and NMOSdevice 494.

Further, FIG. 4A shows a driver 401 including a driver portion 411 athat is configured to cooperate with one level shifter circuit (notshown), such as a positive voltage level shifter, and a driver portion411 b that is configured to cooperate with another level shifter circuit(not shown), such as a negative voltage level shifter, in accordancewith some embodiments. In some embodiments, driver portion 411 a can beconfigured to operate during a programming operation, and driver portion411 b can be configured to operate during an erase operation. Toillustrate, consider that input terminal 402 is coupled to path 280(e.g., the +V/V0 output) of level shifter 244 of FIG. 2 and that inputterminal 404 is coupled to path 282 (e.g., the V0/+V output). Furtherconsider that input terminal 406 is coupled to path 290 (e.g., the V0/−Voutput) of level shifter 246 of FIG. 2 and that input terminal 408 iscoupled to path 292 (e.g., the −V/V0 output). Further consider thatdriver 401 is associated with an X-line decoder to drive a selectedX-line, which is an array line (e.g., 182′), with a portion of thevoltage (e.g., 0 to +V volts) for a second voltage range (e.g., −V to +Vvolts). When 0 volts and +3 volts (from the positive voltage levelshifter) are applied to input terminal 402 and terminal 404,respectively, driver 401 generates +3V at output terminal 410, whereasthe negative voltage level shifter is unselected. Thus, the negativevoltage level shifter can transmit 0V to both input terminals 406 and408, thereby causing driver portion 411 b to be unselected (and does notparticipate in generating a negative voltage). Note that as used herein,the term “driver portion” can be referred, at least in some embodiments,to the subset of functionality of a driver that is responsive to signalsoriginating from a voltage level shifter (e.g., either the negativevoltage level shifter or the positive voltage level shifter).

FIG. 4B shows an example of driver 411 that includes input terminals412, 414, 416, and 418, which determine the mode of operation for driver411. Further, driver 411 can generate an output voltage at outputterminal 420 as a function of the values of the input signals. In theexample shown, consider that driver 411 is disposed in association withan X-line during a programming mode. However, in this example, driver411 is not associated with the X-line being selected. Thus, the valuesof +3 v, 0V, 0V, and 0V on respective input terminals 412, 414, 416, and418 generates 0V at output terminal 420. By driving the X-line with 0V,the X-line is not in a floating state.

FIG. 4C shows an example of driver 421 that includes input terminals422, 424, 426, and 428, which determine the mode of operation for driver421. Further, driver 421 can generate an output voltage at outputterminal 430 as a function of the values of the input signals. In theexample shown, consider that driver 421 is disposed in association withan X-line, whereby driver 421 is used during an erase mode to erase adatum or data stored in a memory cell 181′. In this case, driver 421 canbe configured to generate a portion (i.e., a negative portion) of thesecond range of voltages between −V and +V. Thus, the values of 0V, 0V,−3V, and 0V on respective input terminals 422, 424, 426, and 428 cancause generation of −3V at output terminal 430. As the positive voltagelevel shifter is unselected (during erase modes for X-lines), thepositive voltage level shifter transmits values of 0V to both inputterminals 422 and 424.

FIG. 4D shows an example of driver 431 that includes input terminals432, 434, 436, and 438, which determine the mode of operation for driver431. Further, driver 431 can generate an output voltage at outputterminal 440 as a function of the values of the input signals. In theexample shown, consider that driver is disposed in association with anX-line during an erase mode. However, in this example, driver 431 is notassociated with an X-line that is selected. Thus, the values of 0V, 0V,0V, and −3V on respective input terminals 432, 434, 436, and 438generates 0V at output terminal 440.

In view of the foregoing, a driver can generate a first voltageassociated with a programming operation (e.g., a voltage between 0 and+V), a second voltage associated with the erase operation (e.g., avoltage between −V and 0), and a third voltage associated an unselectedstate for the driver (e.g., 0 volts). In some embodiments, driver 401can be configured to be composed of four-terminal devices having a firstterminal, a second terminal, a third terminal, and a fourth terminal.Further, the four-terminal devices can also include a well (e.g., inwhich the four-terminal devices are formed) coupled to the fourthterminal and to one of the first terminal, the second terminal, or thethird terminal. In some embodiments, the four-terminal devices can beMOS devices, such as PMOS and NMOS devices. Thus, the first terminal,the second terminal, the third terminal, and the fourth terminal cancorrespond respectively to, for example, a drain terminal, a gateterminal, a source terminal, and a well (or bulk) terminal. In someembodiments, the well terminal is coupled to the source terminal to, forexample, maintain appropriate voltage differentials. Thus, the voltagedifferentials across pairs of the terminals of the MOS devices can bemaintained within the first voltage range (e.g., between a range of −Vto 0 volts or a range of 0 to +V volts) to, among other things, preservethe integrity of an oxide structure and the junctions in the MOS devices(e.g., oxide structure OX 195, junction between source 196 and well 197,and junction between drain 192 and well 197 in FIG. 1A). Therefore, indriver 401, the four-terminal devices can be configured to collaboratewith one another to generate negative portions (e.g., −V to 0 volts) andpositive portions (e.g., 0 to +V volts) of a voltage for a secondvoltage range (e.g., −V to +V volts) using voltage differences acrosstwo of any of the first terminal, the second terminal, the thirdterminal, and the fourth terminal in the first voltage range of either−V to 0 volts or 0 to +V volts. In some other embodiments, the sourceand well terminals need not be coupled.

FIG. 5 depicts a secondary decoder 550 including a number of stages,according to at least some embodiments of the invention. In thisexample, secondary decoder 550 can be configured as a tree decoder thatis composed of MOS devices, such as NMOS devices, having any number ofstages. Namely, secondary decoder 550 can include a first stage 552 anda second stage 554, with other stages not shown. First stage 552 andsecond stage 554 can be controlled by predecoded signals on path 547.Further, a signal sent via path 549 can be propagated through the treestructure of MOS devices, as a function of the values of predecodedsignals on path 547. Leakers 556 can be optional, and, if used, canensure that the conductive array lines (e.g., 182 and 185) are notfloating or in some unintended state.

FIG. 6 depicts a decoder 600 including a predecoder and a secondarydecoder, according to at least some embodiments of the invention. Inthis example, decoder 600 includes predecode logic 641 and level shiftercircuit 642, which, in turn, includes level shifters 644 and 646, anddriver 643. Further, decoder 600 includes secondary decoder 650, whichoperates as a post-decoder, and includes a first stage 652, a secondstage 654, and optional leakers 656. In this example, predecoder isconfigured to generate a −3 volt signal at line 649, and predecode logic641 is configured to transmit control signals to route the −3 voltsignal via a path 651 to the selected conductive array line 690, which,in turn, is coupled to an array line associated with a memory cell uponwhich a memory operation is performed. Predecode logic 641 can includecomponents similar to logic 301, negative level shifter 303 a, positivelevel shifter 303 b and driver 306 from FIG. 3A. To pass a 3 volt signalat selected conductive array line 690, some designs could have path 647be at about 4 volts while other designs could build secondary decoder650 gates in a design similar to the row selector 307 of FIG. 3A.

In at least some examples, the structures and/or functions of any of theabove-described features can be implemented in software, hardware,firmware, circuitry, or a combination thereof. Note that the structuresand constituent elements above, as well as their functionality, may beaggregated with one or more other structures or elements. Alternatively,the elements and their functionality may be subdivided into constituentsub-elements, if any. As software, the above-described techniques may beimplemented using various types of programming or formatting languages,frameworks, syntax, applications, protocols, objects, or techniques. Ashardware and/or firmware, the above-described techniques may beimplemented using various types of programming or integrated circuitdesign languages, including hardware description languages, such as anyregister transfer language (“RTL”) configured to designfield-programmable gate arrays (“FPGAs”), application-specificintegrated circuits (“ASICs”), or any other type of integrated circuit.These can be varied and are not limited to the examples or descriptionsprovided.

Various embodiments or examples of the invention may be implemented innumerous ways, including as a system, a process, an apparatus, or aseries of program instructions on a computer readable medium such as acomputer readable storage medium or a computer network where the programinstructions are sent over optical, electronic, or wirelesscommunication links. In general, operations of disclosed processes maybe performed in an arbitrary order, unless otherwise provided in theclaims.

A detailed description of one or more examples is provided herein alongwith accompanying figures. The detailed description is provided inconnection with such examples, but is not limited to any particularexample. The scope is limited only by the claims, and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the description in order to provide athorough understanding. These details are provided as examples and thedescribed techniques may be practiced according to the claims withoutsome or all of the accompanying details. They are not intended to beexhaustive or to limit the invention to the precise forms disclosed, asmany alternatives, modifications, equivalents, and variations arepossible in view of the above teachings. For clarity, technical materialthat is known in the technical fields related to the examples has notbeen described in detail to avoid unnecessarily obscuring thedescription.

The description, for purposes of explanation, uses specific nomenclatureto provide a thorough understanding of the invention. However, it willbe apparent that specific details are not required in order to practicethe invention. In fact, this description should not be read to limit anyfeature or aspect of the present invention to any embodiment; ratherfeatures and aspects of one example can readily be interchanged withother examples. Notably, not every benefit described herein need berealized by each example of the present invention; rather any specificexample may provide one or more of the advantages discussed above. Inthe claims, elements and/or operations do not imply any particular orderof operation, unless explicitly stated in the claims. It is intendedthat the following claims and their equivalents define the scope of theinvention.

1. An integrated circuit, comprising: a substrate; a base layer formedon the substrate and including discrete devices configured to operatewithin a first voltage range; at least one cross-point memory arrayformed above the base layer and electrically coupled with the devices inthe base layer, each cross-point memory array including a plurality ofX-line conductive array lines, a plurality of Y-line conductive arraylines, and re-writable two-terminal memory cells configured to operatewithin a second voltage range that is greater than the first voltagerange, each memory cell having one terminal electrically coupled withone of the plurality of X-line conductive array lines and anotherterminal electrically coupled with one of the plurality of Y-lineconductive array lines; an X-line decoder including a first subset ofthe discrete devices that operate in the first voltage range; and aY-line decoder including a second subset of the discrete devices thatoperate in the first voltage range, wherein the X-line decoder and theY-line decoder are configured to collectively generate a voltage in thesecond voltage range and to apply the voltage in the second voltagerange across at least one of the plurality of the X-line conductivearray lines and at least one of the plurality of the Y-line conductivearray lines, whereby no single discrete device is subject to the secondvoltage range.
 2. The integrated circuit of claim 1 and furthercomprising: a decoder portion that comprises a portion of the X-linedecoder, the decoder portion including a level shifter circuitconfigured to generate at least a portion of the voltage in the secondvoltage range.
 3. The integrated circuit of claim 2, wherein the levelshifter circuit further comprises a negative voltage level shifterincluding an input terminal configured to receive a either a referencevoltage or a voltage in the first voltage range that represents alogical value, and an output terminal, wherein the negative voltagelevel shifter is configured to translate the voltage in the firstvoltage range into a negative voltage.
 4. The integrated circuit ofclaim 3, wherein the negative voltage level shifter further comprisesanother output terminal, and wherein the negative voltage level shifteris configured to translate the voltage in the first voltage range intoanother voltage.
 5. The integrated circuit of claim 2, wherein the levelshifter circuit further comprises a positive level shifter configured totranslate a voltage in the first voltage range into a positive voltage.6. The integrated circuit of claim 2, wherein the decoder portionfurther comprises a driver that includes a first driver portionconfigured to operate in response to the level shifter circuit, and asecond driver portion configured to operate in response to another levelshifter circuit, wherein a selected one of the first driver portion orthe second driver portion is selected to facilitate the generation ofthe portion of the voltage in the second voltage range and the driverportion that is not selected comprises an unselected driver portion. 7.The integrated circuit of claim 1, wherein the X-line decoder furthercomprises a plurality of four-terminal devices, each four-terminaldevice including a first terminal, a second terminal, a third terminal,and a fourth terminal, and a well in which each four terminal device isformed, the well being coupled to the fourth terminal and to a selectedone of the first terminal, the second terminal, or the third terminal,wherein the four-terminal devices are configured to collaborate with oneanother to generate negative portions and positive portions of thevoltage in the second voltage range level while maintaining voltagedifferences across two of any of the first terminal, the secondterminal, the third terminal, and the fourth terminal in the firstvoltage range.
 8. The integrated circuit of claim 2, wherein the levelshifter circuit further comprises a plurality of three-terminal devices,each three-terminal device including a first terminal, a secondterminal, and a third terminal, wherein the three-terminal devices areconfigured to collaborate with one another to generate the portion ofthe voltage in the second voltage range level while maintaining voltagedifferences across two of any of the first terminal, the secondterminal, and the third terminal being in the first voltage range. 9.The integrated circuit of claim 8, wherein each three-terminal devicefurther comprises a well with which each of the three-terminal devicesis formed, and a fourth terminal electrically coupled with the well andwith a selected one of the first terminal, the second terminal, or thethird terminal, wherein the three-terminal devices are configured tocollaborate with one another to generate the portion of the voltage inthe second voltage range level using voltage differences across two ofany of the first terminal, the second terminal, the third terminal, andthe fourth terminal being in the first voltage range.
 10. The integratedcircuit of claim 1, wherein the X-line decoder circuit is configured toselectively apply the portion of the voltage to only one of theplurality of X-line conductive array lines.
 11. An integrated circuit,comprising: a substrate; arrays of multiple layers of memory formedabove the substrate, each array including a plurality of conductivearray lines, and a plurality of re-writable memory cells operative tostore data as a plurality of conductivity profiles, each memory cellincluding two terminals and configured to modify its conductivityprofile in response to a first potential difference applied across thetwo terminals; and a base layer formed on the substrate and includinglogic including MOS devices and being configured to determine a dataoperation, and further configured to activate either the negativevoltage level shifter or the positive voltage level shifter as afunction of the data operation, and a driver including other MOS devicesand being electrically coupled with the negative voltage level shifterand the positive voltage level shifter, the driver being configured todrive either a negative range of voltages or a positive range ofvoltages on one or more of the plurality of conductive array lines,wherein the MOS devices and the other MOS devices are configured tooperate at or below a second potential difference, and wherein thesecond potential difference is less than the first potential difference.12. The integrated circuit of claim 11, wherein oxide structures in theMOS devices and the other MOS devices are configured to operate withvalues of voltages associated with the second potential difference. 13.The integrated circuit of claim 11, wherein the negative voltage levelshifter further comprises a first output terminal and a second outputterminal, a first level shifter configured to generate a negativevoltage at the first output terminal during a first state, and togenerate a reference voltage at the first output terminal during asecond state, and a second level shifter configured to generate thereference voltage at the second output terminal during the first state,and to generate the negative voltage at the second output terminalduring the second state, wherein the first level shifter and secondlevel shifter are configured to operate substantially concurrent witheach other.
 14. The integrated circuit of claim 11, wherein the negativevoltage level shifter further comprises a first cross-coupled pair ofMOS devices configured to apply a negative voltage to the first outputterminal during a first state, and to apply a reference voltage to thefirst output terminal during a second state, a second cross-coupled pairof MOS devices configured to apply the reference voltage to the secondoutput terminal during the first state, and apply the negative voltagereference voltage to the second output terminal during the second state;a first MOS inverter, and a second MOS inverter electrically coupledwith the first MOS inverter, wherein the first MOS inverter and thesecond MOS inverter are configured to modify operation of the firstcross-coupled pair of MOS devices and the second cross-coupled pair ofMOS devices.
 15. The integrated circuit of claim 11, wherein the driverfurther comprises a first driver portion configured to operate during aprogramming operation, and a second driver portion configured to operateduring an erase operation.
 16. The integrated circuit of claim 15,wherein the driver is configured to generate a first voltage associatedwith the programming operation, a second voltage associated with theerase operation, and a third voltage associated with an unselected statefor the driver.
 17. The integrated circuit of claim 11, wherein thedriver further comprises a first input terminal electrically coupledwith a gate of a first PMOS device and a gate of a first NMOS device, asecond input terminal electrically coupled with a source and a well ofthe first PMOS device and with a source and a well of a second PMOSdevice, a third input terminal electrically coupled with a source and awell of a second NMOS device and with a source and a well of the firstNMOS device, a fourth input terminal electrically coupled with a gate ofthe second NMOS device and a gate of the second PMOS device, and anoutput terminal electrically coupled with a drain of each of the firstPMOS device, the first NMOS device, the second PMOS device, and thesecond NMOS device.
 18. The integrated circuit of claim 11, wherein eachmemory cell includes a two-terminal memory element electrically inseries with the two terminals of the memory cell.
 19. The integratedcircuit of claim 18, wherein each memory cell further includes anon-ohmic device (NOD) electrically in series with the memory elementand the two terminals of the memory cell.
 20. An integrated circuit,comprising: a substrate; arrays of multiple layers of memory formedabove the substrate, each array including a plurality of conductivearray lines, and a plurality of re-writable memory cells operative tostore data as a plurality of conductivity profiles, each memory cellincluding two terminals and configured to modify its conductivityprofile in response to a first potential difference applied across thetwo terminals; and a base layer formed on the substrate and includingX-line decoders including negative voltage level shifters and positivevoltage level shifters, and Y-line decoders including other negativevoltage level shifters and other positive voltage level shifters, thenegative voltage level shifters and the other positive voltage levelshifters being configured to cooperate with one another to generate thefirst potential difference having a first polarity, and the positivevoltage level shifters and the other negative voltage level shiftersbeing configured to cooperate with one another to generate the firstpotential difference having a second polarity, wherein the X-linedecoders and the Y-line decoders include devices that are configured tooperate with a second potential difference among gates, sources, anddrains of the devices, the second potential difference being less thanthe first potential difference.
 21. The integrated circuit of claim 20,wherein each memory cell includes a non-ohmic device (NOD) electricallyin series with the two terminals of the memory cell.
 22. The integratedcircuit of claim 20, wherein each memory cell includes an electrolytictunnel barrier, a mixed valence conductive oxide, and an interfacebetween the electrolytic tunnel barrier and the mixed valence conductiveoxide, and wherein the first potential difference applied across the twoterminals causes oxygen ions to move across the interface.